III-V Lab showcased the groundbreaking SHIFT project during the recent Compound Semiconductor Week (CSW), held from June 3-6, 2024, at Lund University in Sweden. CSW 2024, the premier conference in the field of compound semiconductors, brings together experts and researchers to discuss the latest advancements in science, technology, and applications of these critical materials.
The SHIFT project was presented with a focus on the TiW-based InP Double Heterojunction Bipolar Transistor (DHBT) technology with high fabrication yield, designed for next-generation communication systems' analog front-end integrated circuits. This technology will enable <0.4-µm-emitter-width DHBTs with reduced base-link resistance, promising enhanced frequency performance. TiW-based InP DHBT driver and analog-multiplexer driver integrated circuits demonstrating state-of-the-art performances with high yield were presented.
CSW 2024 covered a broad spectrum of topics, from the fundamentals of compound semiconductors to their practical applications in electronics, optoelectronics, and emerging fields. The conference serves as a vital forum for sharing the latest research and developments, fostering collaboration, and inspiring innovation among professionals and academics alike.
The SHIFT project, which is supported by the Chips Joint Undertaking and its members with additional funding from national authorities under grant agreement n° 101096256, is part of a broader initiative to push the boundaries of semiconductor technology. This presented work has also received partial funding from the H2020 ICT TWILIGHT project (contract No. 781471) under the Photonics Public-Private Partnership (PPP).
As the demand for faster and more efficient communication systems continues to grow, the innovations presented at CSW 2024 underscore the importance of ongoing research and collaboration in the compound semiconductor sector. The SHIFT project exemplifies the cutting-edge advancements that are driving the industry forward and shaping the future of global communications.
